Silitronics

Silitronics provides advanced semiconductor and photonics packaging, including design, fabrication, dicing, silicon photonics, assembly, and chiplet-related services. The company supports heterogeneous integration and multi-chiplet SiP packaging, with capabilities such as wafer thinning/polishing/dicing (including stealth laser), build-up substrate fabrication, and precision assembly (e.g., flip-chip, wire bonding, and active alignment). Silitronics also offers engineering evaluation for DFM/DFA/DFQ using CAD tools and multi-physics analysis, plus testing and reliability protocols including electrical testing, optical validation, and thermal/stress testing. It operates a 20,000 sq ft automated ISO 9001 facility in San Jose, California, and positions itself as a “one-stop” partner for turnkey solutions from prototype to volume production. Its solutions target applications such as next-gen ADAS/LiDAR, AI/HPC/6G, data center and cloud photonics, AR/VR camera sensors, defense high-reliability assembly, IoT sensor SiP modules/MEMS, and medical in vitro/in vivo needs.

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